EEEE3098 Solid State Devices Examples Problems 3
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EEEE3098 Solid State Devices Examples Problems 3
3. 1) Calculate the depletion layer thickness of a GaAs p-n junction formed from an n-type
layer doped at 1016 cm-3 and a p-type layer doped at 1017 cm-3 . (Assume that the built in voltage is 1 volt.) If carriers cross the depletion layer with a saturation drift velocity 107 cm/s, what is the transit time? If the thickness of the n-layer is 10m and the mobility is 1000 cm2/Vs, calculate the RC time constant for the structure. How will these results change if the junction is reverse biased with a voltage supply of 8 volts?
wdepl = √ ( + ) (Vbi − V)
wdepl
= √ ( + ) (1 V − 0)
Remember 1F = 1 C/V …
wdepl = √ 1.60x10−9 F V C−1 = 4.0x10−5cm = 0.40 um
wdepl 4.0x10−5cm
Ctransit = vsat = 1x107cm s −1 = 4.0 ps
Cdepl ese0 13.2(8.85x10−14 F cm−1)
A wdepl 4.0x10−5cm
Since Nd < Na, I will neglect the resistance of the p-type layer.
RA = pL = = = = 6.2x10−4Ω cm2 RC = RCdepl = RA () = 6.2x10−4 Ω cm2 (29 nF cm−2) = 18 ps
In this case (V = 0), the speed of the diode is limited by the RC time constant.
For V = -8 V:
Under reverse bias, the depletion width increases. This decreases the capacitance and RC time constant, but increases the carrier transit time across the pn junction. In this case, the diode response is now transit-time limited.
Cdepl
A
wdepl = 1.20 um
Ctransit = 12.0 ps
CRC = 6. 1 ps
3.2) Show that the total number of minority electrons injected into a diode with a long p-
base is given by np(0)Ln, where np(0) is the injected electron carrier density at the edge of the depletion region and Ln is the minority electron diffusion length.
anp (x) 1 aJn (x) np (x) − np0
at q ax Tn
Jn (x) = qunn(x)E(x) + qDn ≅ qDn
where we have used the fact that E(x) 0 in the quasi-neutral p-base region. Substituting the 2nd equation into the first equation gives:
a2np (x) np (x) − np0
ax2 Tn
Let np(´)(x) ≡ np (x) − np0 gives:
a2np(´)(x) np(´)(x)
ax2 Tn
The solution to this equation is: Let np(´)(x) = A exp {} + B exp {} where Ln ≡ √Dn Tn
If we assume that the n-base is on the right-hand side, then the carrier density must decrease as the carriers diffuse towards the right and recombine. This means that B=0 for this case. Thus, we obtain:
np(´)(x) = np(´)(0)exp {}
n´p (x)
0 Lp x
To obtain the total number of minority electrons in the p-base, we simply integrate their density across the width of the p-base:
∞
Total number of minority electrons = ∫ np(´)(0)exp{} dx
0
Total number of minority electrons == −np(´)(0)Lnexp{ }| = −np(´)(0)Ln[0 − 1]
Total number of minority electrons = np(´)(0)Ln
3.3) Consider a silicon pn diode with a junction area is 100m x 100m. The n- and p-type
regions have doping concentrations of Nd = 1x1016 cm-3 and Na = 1x1018 cm-3 with corresponding layer thicknesses of Wn = 500m and Wp = 4m. The electron and hole mobilities are n = 1250 cm V2- 1s and p = 100 cm V2- 1s and the minority carrier lifetimes are Tn = Tp = 10s. Assuming that a current of 10mA is flowing, do the following:
[For this question, answers are given, but not the worked solutions. (You are expected to do these yourself…)]
a) Calculate the minority carrier diffusion lengths, Ln and Lp,
Answers: Ln = 180 m and Lp = 50.9 m
b) Explain whether the n- and p-regions correspond to long or short bases.
Answers: Long n-base and short p-base
c) Calculate the current density across the junction and the voltage that needs to be applied for this current to flow;
Answers: J = 100 A cm-2 and V = 0.806V
d) Calculate the excess minority carrier distributions in the n- and p-regions.
Answers:
Assuming that the p-side of the junction is on the left (x<0):
np(´)(x) = 4.36x1015 [1 + 2500x] cm −3
pn(´)(x) = 4.36x1017 exp(−196x)
where x is in cm …
e) Calculate the diffusion capacitances associated with the minority electrons in the p- base and the minority holes in the n-base.
Answers: Cdiff_n = 583 pF and Cdiff_p = 1.48 F
(n.b. Use the correct equations for short- and long- bases and the bias from Q3.3c …)
f) Calculate the depletion width, Wdepl .
Answer: Wdepl = 50 nm
g) Calculate the junction capacitance, Cdepl .
Answer: Cdepl = 2.08 nF
3.4) Draw the small signal equivalent circuit of a discrete pn diode, being sure to include
parasitic circuit elements. Explain the physical origin of each term.
Lw = bond wire inductance
Rs = series resistance of the quasi-neutral
bases and the contact resistances
rd = differential resistance, rd = nkT/qI
Cj = depletion capacitance ofjunction E-field
Cdiff = diffusion capacitance of injected
minority carriers
3.5) You are asked to design a simple pn diode for an application requiring a breakdown
voltage of 1000V. For low doping levels, the avalanche breakdown field of silicon is EBR = 2x105 V/cm. If the p-type layer (top layer) has a doping density of Na = 1x1018 cm-3, what is the maximum n-type doping concentration your pn diode can have? (Be sure to leave a safety margin (e.g. 20%) in the breakdown voltage.) Plot the electric field distribution across the depletion region.
Increasing the breakdown voltage by 20% give a design value of VBR=1200 V.
+ ) (Vbi + 1200V)
xn = ( ) wdepl = √
but
Emax = = √ () (Vbi + 1200V)
so
es e0 Em(2)ax Na Nd 1 1 −1
2q(Vbi + 1200V) Na + Nd Na Nd
2q(Vbi + 1200V) 1 −1
es e0 Em(2)ax Na
where
kT Na Nd
q ni(2)
If we guess Nd = 1015 cm-3, then
Vbi = 0.0259ln () = 0.765 V
In turn, this gives:
Nd = [ − ]
Nd = 1.086x1014 cm −3
= √2(11.8)(8.854x10−14F cm−1) ( 1 + 1 ) (1200.7V)
wdepl = 120 um
xn ≅ wdepl and xp ≅ () wdepl ≅ 0.0001 wdepl
qNdwdepl
E
-xp
- Emax
3.6) Can you think of a better device structure for the diode in question 3.5, which is
capable of supporting the same breakdown voltage with a thinner depletion region?
If we use a pin diode, we can support this voltage (1200 V) with:
wi ≅ = 6x10−3cm = 60 um
Note: For the pn diode in the previous question (Q3.5), this required a depletion region thickness of Wdepl = 120 m!
2023-01-11